74AUP1G240GN vs 74AUP1G240GW feature comparison

74AUP1G240GN NXP Semiconductors

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74AUP1G240GW NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON TSSOT
Package Description 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5
Pin Count 6 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G5
JESD-609 Code e3 e3
Length 1 mm 2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SON TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 26.8 ns 26.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.35 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.3 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 0.9 mm 1.25 mm
Base Number Matches 2 2
Pbfree Code Yes
Control Type ENABLE LOW
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Prop. Delay@Nom-Sup 26.8 ns

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