74AUP1G34GW-Q100 vs 74LVC1G34GF,132 feature comparison

74AUP1G34GW-Q100 Nexperia

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74LVC1G34GF,132 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, 1 X 1 X 0.50 MM PITCH, PLASTIC, SOT-891, XSON-6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V LVC/LCX/Z
JESD-30 Code R-PDSO-G5 S-PDSO-N6
JESD-609 Code e3 e3
Length 2.05 mm 1 mm
Load Capacitance (CL) 30 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP5,.08 SOLCC6,.04,14
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.0014 mA
Propagation Delay (tpd) 20.8 ns 20.8 ns
Schmitt Trigger YES NO
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1 mm
Base Number Matches 2 2
Part Package Code SON
Pin Count 6
Manufacturer Package Code SOT891
Packing Method TR
Prop. Delay@Nom-Sup 5.2 ns
Qualification Status Not Qualified

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