74AUP1G373GW vs 74AUP1G374GW feature comparison

74AUP1G373GW NXP Semiconductors

Buy Now Datasheet

74AUP1G374GW NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT-363 SOT-363
Package Description PLASTIC, SOT-363, SC-88, 6 PIN PLASTIC, SOT-363, SC-88, SMT-6
Pin Count 6 6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm 2 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type D LATCH D FLIP-FLOP
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 25.6 ns 21.6 ns
Propagation Delay (tpd) 25.9 ns 21.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Max Frequency@Nom-Sup 70000000 Hz
fmax-Min 360 MHz

Compare 74AUP1G373GW with alternatives

Compare 74AUP1G374GW with alternatives