74F764AN vs D82031 feature comparison

74F764AN NXP Semiconductors

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D82031 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP INTEL CORP
Package Description , DIP, DIP40,.6
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 18 14
Boundary Scan NO NO
Bus Compatibility 68020; 68000; 8086; Z-80 8086; 8088; 80186; 80188
External Data Bus Width
JESD-30 Code R-PDIP-T48 R-PDIP-T40
Low Power Mode NO NO
Memory Organization 256K X 1
Number of Banks 1 4
Number of Terminals 48 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 210 mA 290 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 4 1
Rohs Code No
Part Package Code DIP
Pin Count 40
JESD-609 Code e0
Length 52.07 mm
Package Code DIP
Package Equivalence Code DIP40,.6
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 15.24 mm

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