74HC03DB-Q100 vs MC74HC00AFEL feature comparison

74HC03DB-Q100 NXP Semiconductors

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MC74HC00AFEL Rochester Electronics LLC

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP SOIC
Package Description SSOP, EIAJ, SO-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 6.2 mm 10.2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 145 ns 110 ns
Screening Level AEC-Q100
Seated Height-Max 2 mm 2.05 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.275 mm
Base Number Matches 2 2
Pbfree Code Yes
JESD-609 Code e4
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 260
Qualification Status COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 40