74HC132D vs GD54HC00J feature comparison

74HC132D Toshiba America Electronic Components

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GD54HC00J LG Semicon Co Ltd

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Rohs Code Yes No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer TOSHIBA CORP LG SEMICON CO LTD
Package Description SOIC-14 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day
Date Of Intro 2016-05-25
Samacsys Manufacturer Toshiba
Family HC/UH
JESD-30 Code R-PDSO-G14 R-XDIP-T14
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0052 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Equivalence Code SOP14,.23 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 50 mA
Propagation Delay (tpd) 160 ns
Schmitt Trigger YES NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 4 2
JESD-609 Code e0
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Terminal Finish Tin/Lead (Sn/Pb)