74HC138D vs 74HC138BQ feature comparison

74HC138D Toshiba America Electronic Components

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74HC138BQ NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Package Description SOIC-16 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day
Date Of Intro 2016-05-25
Samacsys Manufacturer Toshiba
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PQCC-N16
Length 9.9 mm 3.5 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVQCCN
Package Equivalence Code SOP16,.25 LCC16,.1X.14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 225 ns 225 ns
Seated Height-Max 1.75 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 2.5 mm
Base Number Matches 1 4
Pbfree Code Yes
Part Package Code QFN
Pin Count 16
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Prop. Delay@Nom-Sup 45 ns
Qualification Status Not Qualified
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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