74HC157PW,118 vs 74AHC157BQ feature comparison

74HC157PW,118 NXP Semiconductors

Buy Now Datasheet

74AHC157BQ Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP
Package Description SOT-403-1, TSSOP-16 HVQCCN, LCC16,.1X.14,20
Pin Count 16
Manufacturer Package Code SOT403-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G16 R-PQCC-N16
JESD-609 Code e4 e4
Length 5 mm 3.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP16,.25 LCC16,.1X.14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 38 ns 10.5 ns
Propagation Delay (tpd) 38 ns 16.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 2.5 mm
Base Number Matches 2 2
Date Of Intro 1999-09-24
Power Supply Current-Max (ICC) 0.08 mA

Compare 74HC157PW,118 with alternatives

Compare 74AHC157BQ with alternatives