74HC1G00GW vs TC7SH00FS feature comparison

74HC1G00GW NXP Semiconductors

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TC7SH00FS Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC SON
Package Description PLASTIC, SC-88A, 5 PIN VSOF, FL6,.03,14
Pin Count 5 5
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-F5
JESD-609 Code e3 e0
Length 2 mm 1 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.002 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSOF
Package Equivalence Code TSSOP5/6,.08 FL6,.03,14
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns 13 ns
Propagation Delay (tpd) 135 ns 13 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING FLAT
Terminal Pitch 0.65 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 0.8 mm
Base Number Matches 9 2

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