74HC1G04GV
vs
MC74HC1G04DTT1G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
| Part Package Code |
SOIC
|
TSOP-5
|
| Package Description |
PLASTIC, SC-74A, 5 PIN
|
TSOP-5
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 mm
|
3 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Max I(ol) |
0.002 A
|
0.0026 A
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
27 ns
|
90 ns
|
| Propagation Delay (tpd) |
135 ns
|
155 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.5 mm
|
1.5 mm
|
| Base Number Matches |
5
|
1
|
| Manufacturer Package Code |
|
483
|
| Factory Lead Time |
|
52 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
25 mA
|
|
|
|
Compare 74HC1G04GV with alternatives
Compare MC74HC1G04DTT1G with alternatives