74HC1G32GW vs TC7S32FU(TE85L,F) feature comparison

74HC1G32GW Philips Semiconductors

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TC7S32FU(TE85L,F) Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.002 A 0.002 A
Moisture Sensitivity Level 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code SSOP
Package Description TSSOP, TSSOP5/6,.08
Pin Count 5
Factory Lead Time 12 Weeks
Family HC/UH
Length 2 mm
Number of Functions 1
Number of Inputs 2
Packing Method TR
Propagation Delay (tpd) 125 ns
Seated Height-Max 1.1 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm

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