74HC1G32GW vs TC7SH32FU feature comparison

74HC1G32GW Philips Semiconductors

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TC7SH32FU Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.002 A 0.008 A
Moisture Sensitivity Level 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code No
Part Package Code SSOP
Package Description TSSOP, TSSOP6,.08
Pin Count 5
Family HC/UH
Length 2 mm
Number of Functions 1
Number of Inputs 2
Power Supply Current-Max (ICC) 50 mA
Propagation Delay (tpd) 13 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm

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