74HC1G66GW
vs
74HC1G66GW-T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Package Description |
TSSOP-5
|
TSSOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
1998-08-03
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
|
| Normal Position |
NO
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
50 dB
|
50 dB
|
| On-state Resistance-Max (Ron) |
142 Ω
|
142 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP5,.08
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Current-Max (Isup) |
0.04 mA
|
|
| Supply Voltage-Max (Vsup) |
10 V
|
10 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
225 ns
|
45 ns
|
| Switch-on Time-Max |
150 ns
|
30 ns
|
| Switching |
MAKE-BEFORE-BREAK
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
9
|
1
|
| Part Package Code |
|
TSSOT
|
| Pin Count |
|
5
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
|
|
|
Compare 74HC1G66GW with alternatives
Compare 74HC1G66GW-T with alternatives