74HC4052BQ,115
vs
74HC4052BQ
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16
|
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT763-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PQCC-N16
|
R-PQCC-N16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
3.5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Max (Vsup) |
-5 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-1 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-4.5 V
|
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
6 Ω
|
|
| On-state Resistance-Max (Ron) |
195 Ω
|
270 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCN
|
| Package Equivalence Code |
LCC16,.1X.14,20
|
LCC16,.1X.14,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Signal Current-Max |
0.025 A
|
0.025 A
|
| Supply Current-Max (Isup) |
0.32 mA
|
0.32 mA
|
| Supply Voltage-Max (Vsup) |
10 V
|
10 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
57 ns
|
|
| Switch-on Time-Max |
69 ns
|
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.5 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare 74HC4052BQ,115 with alternatives
-
74HC4052BQ,115 vs 74HC4052BQ-Q100
-
74HC4052BQ,115 vs 74HC4052D,652
-
74HC4052BQ,115 vs HD74HC4052RPEL
-
74HC4052BQ,115 vs 74HC4052D,653
-
74HC4052BQ,115 vs MM74HC4052MX_NL
-
74HC4052BQ,115 vs CD74HC4052M
-
74HC4052BQ,115 vs 74HC4052D-Q100
-
74HC4052BQ,115 vs CD74HC4052M96E4
-
74HC4052BQ,115 vs 933714830652