74HC4052BQ-Q100
vs
74HC4052D-Q100
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Package Description |
HVQCCN,
|
SOP-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SP4T
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3.5 mm
|
9.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
4
|
4
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
50 dB
|
50 dB
|
| On-state Resistance-Max (Ron) |
270 Ω
|
270 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC16,.1X.14,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
10 V
|
10 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
375 ns
|
375 ns
|
| Switch-on Time-Max |
490 ns
|
490 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
2.5 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 74HC4052BQ-Q100 with alternatives