74HC4066D
vs
74HC4066D-Q100
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
3.90 MM, PLASTIC, SOT-108-1, MS-012, SO-14
|
,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e4
|
e4
|
| Length |
8.65 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Normal Position |
NO
|
|
| Number of Channels |
1
|
|
| Number of Functions |
4
|
|
| Number of Terminals |
14
|
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
5 Ω
|
|
| On-state Resistance-Max (Ron) |
142 Ω
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
10 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
YES
|
|
| Switch-off Time-Max |
45 ns
|
|
| Switch-on Time-Max |
30 ns
|
|
| Switching |
MAKE-BEFORE-BREAK
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
|
| Base Number Matches |
4
|
2
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare 74HC4066D with alternatives
Compare 74HC4066D-Q100 with alternatives