74HC4066N,652
vs
MC74HC4066AN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, PLASTIC, SOT-27-1, MO-001, DIP-14
|
DIP, DIP14,.3
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT27-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
19.025 mm
|
18.86 mm
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Off-state Isolation-Nom |
50 dB
|
40 dB
|
| On-state Resistance Match-Nom |
5 Ω
|
20 Ω
|
| On-state Resistance-Max (Ron) |
142 Ω
|
120 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
4.69 mm
|
| Supply Voltage-Max (Vsup) |
10 V
|
12 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
2 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
45 ns
|
80 ns
|
| Switch-on Time-Max |
30 ns
|
80 ns
|
| Switching |
MAKE-BEFORE-BREAK
|
MAKE-BEFORE-BREAK
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
4
|
|
|
|
Compare 74HC4066N,652 with alternatives