74HC4514PW,118 vs HD74HC4514RP feature comparison

74HC4514PW,118 NXP Semiconductors

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HD74HC4514RP Hitachi Ltd

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HITACHI LTD
Part Package Code TSSOP2 SOIC
Package Description SOT-355, 24 PIN SOP,
Pin Count 24 24
Manufacturer Package Code SOT355-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature ADDRESS LATCHES
Family HC/UH HC/UH
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4
Length 7.8 mm 15.8 mm
Load Capacitance (CL) 50 pF
Logic IC Type OTHER DECODER/DRIVER OTHER DECODER/DRIVER
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 69 ns 250 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 2.5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 8.4 mm
Base Number Matches 1 1
ECCN Code EAR99

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