74HC594N
vs
74HC595D-Q100,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP-16
|
3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| Max Frequency@Nom-Sup |
20000000 Hz
|
20000000 Hz
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOP
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
SOT109-1
|
| Count Direction |
|
RIGHT
|
| Family |
|
HC/UH
|
| Length |
|
9.9 mm
|
| Logic IC Type |
|
SERIAL IN PARALLEL OUT
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
TRUE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
240 ns
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
3.9 mm
|
| fmax-Min |
|
24 MHz
|
|
|
|