74HC595D/T3
vs
HD74HC595RP
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
SERIAL STANDARD OUTPUT FOR CASCADING
|
|
| Count Direction |
RIGHT
|
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
9.9 mm
|
| Logic IC Type |
SERIAL IN PARALLEL OUT
|
SERIAL IN PARALLEL OUT
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
240 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
3.9 mm
|
3.9 mm
|
| fmax-Min |
24 MHz
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare 74HC595D/T3 with alternatives
Compare HD74HC595RP with alternatives