74HC74BQ-Q100 vs 74HC74BQ-Q100,115 feature comparison

74HC74BQ-Q100 NXP Semiconductors

Buy Now Datasheet

74HC74BQ-Q100,115 Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code QFN QFN
Package Description 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 DHVQFN-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PQCC-N14 R-PQCC-N14
Length 3 mm 3 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 265 ns 265 ns
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 2.5 mm 2.5 mm
fmax-Min 24 MHz 24 MHz
Base Number Matches 2 1
Manufacturer Package Code SOT762-1
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
JESD-609 Code e4
Packing Method TR, 7 INCH
Terminal Finish NICKEL PALLADIUM GOLD SILVER

Compare 74HC74BQ-Q100 with alternatives

Compare 74HC74BQ-Q100,115 with alternatives