74HC74BQ-Q100 vs MM54HC107W feature comparison

74HC74BQ-Q100 NXP Semiconductors

Buy Now Datasheet

MM54HC107W National Semiconductor Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code QFN
Package Description 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 DFP, FL14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PQCC-N14 R-GDFP-F14
Length 3 mm 9.614 mm
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code HVQCCN DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 265 ns 37 ns
Screening Level AEC-Q100
Seated Height-Max 1 mm 2.032 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form NO LEAD FLAT
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 2.5 mm 6.35 mm
fmax-Min 24 MHz 18 MHz
Base Number Matches 2 3
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Package Equivalence Code FL14,.3
Qualification Status Not Qualified
Terminal Finish TIN LEAD

Compare 74HC74BQ-Q100 with alternatives

Compare MM54HC107W with alternatives