74HC74BQ-Q100
vs
MM54HC107W
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
QFN
|
|
Package Description |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
|
DFP, FL14,.3
|
Pin Count |
14
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PQCC-N14
|
R-GDFP-F14
|
Length |
3 mm
|
9.614 mm
|
Logic IC Type |
D FLIP-FLOP
|
J-K FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
HVQCCN
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
265 ns
|
37 ns
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1 mm
|
2.032 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Form |
NO LEAD
|
FLAT
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
POSITIVE EDGE
|
NEGATIVE EDGE
|
Width |
2.5 mm
|
6.35 mm
|
fmax-Min |
24 MHz
|
18 MHz
|
Base Number Matches |
2
|
3
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
50 pF
|
Package Equivalence Code |
|
FL14,.3
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 74HC74BQ-Q100 with alternatives
Compare MM54HC107W with alternatives