Findchips: Compare 74HCT132N,652 vs MM54HC132J/883C

74HCT132N,652 vs MM54HC132J/883C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NATIONAL SEMICONDUCTOR CORP
Part Package Code	DIP
Package Description	SOT-27-1, DIP-14	DIP, DIP14,.3
Pin Count	14
Manufacturer Package Code	SOT27-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Samacsys Manufacturer	NXP
Family	HCT	HC/UH
JESD-30 Code	R-PDIP-T14	R-CDIP-T14
JESD-609 Code	e4	e0
Length	19.025 mm
Load Capacitance (CL)	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
Package Code	DIP	DIP
Package Equivalence Code	DIP14,.3	DIP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Packing Method	BULK
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	41 ns
Propagation Delay (tpd)	50 ns	186 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	YES
Seated Height-Max	4.2 mm	5.08 mm
Supply Voltage-Max (Vsup)	5.5 V	6 V
Supply Voltage-Min (Vsup)	4.5 V	2 V
Supply Voltage-Nom (Vsup)	5 V	4.5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	MILITARY
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	TIN LEAD
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	7.62 mm	7.62 mm
Base Number Matches	1	2
Screening Level		MIL-STD-883 Class C
	Logic » Gates	Logic » Gates