74HCT1G66GV
vs
74HCT1G66GW-G
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SC-74A
|
|
| Package Description |
PLASTIC, SOT-753, SC-74A, 5 PIN
|
TSSOP, TSSOP5/6,.08
|
| Pin Count |
5
|
|
| Manufacturer Package Code |
SOT753
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance-Max (Ron) |
142 Ω
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSSOP5/6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
53 ns
|
|
| Switch-on Time-Max |
36 ns
|
36 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.5 mm
|
|
| Base Number Matches |
2
|
3
|
| Switching |
|
MAKE-BEFORE-BREAK
|
|
|
|
Compare 74HCT1G66GV with alternatives