74HCT1G66GW,125 vs 74HCT1G66GW,165 feature comparison

74HCT1G66GW,125 NXP Semiconductors

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74HCT1G66GW,165 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5
Pin Count 5 5
Manufacturer Package Code SOT353-1 SOT353-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2 mm 2 mm
Moisture Sensitivity Level 1 1
Normal Position NO NO
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 5 5
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance-Max (Ron) 142 Ω 142 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Switch-off Time-Max 53 ns 53 ns
Switch-on Time-Max 36 ns 36 ns
Switching MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2

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