74HCT4053DB,118 vs TC4066BP feature comparison

74HCT4053DB,118 NXP Semiconductors

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TC4066BP Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SSOP1 DIP
Package Description 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16 DIP, DIP14,.3
Pin Count 16 14
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Analog IC - Other Type SPDT SPST
JESD-30 Code R-PDSO-G16 R-PDIP-T14
JESD-609 Code e4
Length 6.2 mm 19.25 mm
Moisture Sensitivity Level 1
Number of Channels 1 1
Number of Functions 3 4
Number of Terminals 16 14
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 9 Ω 10 Ω
On-state Resistance-Max (Ron) 180 Ω 950 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP16,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 4.45 mm
Signal Current-Max 0.025 A
Supply Current-Max (Isup) 0.32 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Switch-off Time-Max 44 ns
Switch-on Time-Max 48 ns 120 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code Yes
Samacsys Manufacturer Toshiba
Normal Position NO
Output SEPARATE OUTPUT

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