74HCT7046ADB
vs
CD-700-DAE-SKNN-65M5360000
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
SMD-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
PHASE LOCKED LOOP
|
PHASE LOCKED LOOP
|
| JESD-30 Code |
R-PDSO-G16
|
R-CQCC-N16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Length |
|
7.49 mm
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
LCC16,.2X.3,40
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
2.13 mm
|
| Supply Current-Max (Isup) |
|
63 mA
|
| Terminal Finish |
|
GOLD OVER NICKEL
|
| Terminal Pitch |
|
1.02 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
5.08 mm
|
|
|
|
Compare 74HCT7046ADB with alternatives
Compare CD-700-DAE-SKNN-65M5360000 with alternatives