74LV4066DB-T
vs
74LV4066PW
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Part Package Code |
SSOP
|
|
| Package Description |
SSOP,
|
TSSOP-14
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e4
|
| Length |
6.2 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Off-state Isolation-Nom |
50 dB
|
50 dB
|
| On-state Resistance Match-Nom |
2 Ω
|
2 Ω
|
| On-state Resistance-Max (Ron) |
83 Ω
|
83 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
TSSOP
|
| Package Equivalence Code |
SSOP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
47 ns
|
47 ns
|
| Switch-on Time-Max |
30 ns
|
30 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
5.3 mm
|
4.4 mm
|
| Base Number Matches |
1
|
3
|
| Date Of Intro |
|
1992-08-01
|
|
|
|
Compare 74LV4066DB-T with alternatives
Compare 74LV4066PW with alternatives