74LVC07ADR2G
vs
74LVC07AD-Q100J
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, SOIC-14
|
|
| Manufacturer Package Code |
751A-03
|
SOT108-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
LV/LV-A/LVX/H
|
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
|
| Length |
8.65 mm
|
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
6
|
|
| Number of Inputs |
1
|
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
6.5 ns
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
4.5 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare 74LVC07ADR2G with alternatives