74LVC14APW-T118
vs
IDT74LVC14APG
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
TSSOP, TSSOP14,.25
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
5 mm
|
5 mm
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
10 ns
|
7.5 ns
|
| Seated Height-Max |
1.1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
14
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP14,.25
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Prop. Delay@Nom-Sup |
|
6.4 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
YES
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 74LVC14APW-T118 with alternatives
Compare IDT74LVC14APG with alternatives