74LVC153DB vs MC74LCX257DTR2G feature comparison

74LVC153DB NXP Semiconductors

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MC74LCX257DTR2G onsemi

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Package Description SSOP, TSSOP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 6.2 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 4.4 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code TSSOP-16
Pin Count 16
Manufacturer Package Code 948F-01
Factory Lead Time 16 Weeks
Samacsys Manufacturer onsemi
JESD-609 Code e4
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code TSSOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 7.2 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare 74LVC153DB with alternatives

Compare MC74LCX257DTR2G with alternatives