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74LVC1G04GM,115 vs 74LVC2G14GW feature comparison

74LVC1G04GM,115 NXP Semiconductors

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74LVC2G14GW Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code SON
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count 6
Manufacturer Package Code SOT886
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z
JESD-30 Code R-PDSO-N6 R-PDSO-G6
JESD-609 Code e3 e3
Length 1.45 mm
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER INVERTER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 1
Number of Inputs 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 5.5 ns
Propagation Delay (tpd) 9.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1 mm
Base Number Matches 2 3
Logic » Gates
Logic » Gates

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