Findchips: Compare 74LVC1G17GV,125 vs TC7SZ17FU

74LVC1G17GV,125 vs TC7SZ17FU feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Active
Ihs Manufacturer	NEXPERIA	TOSHIBA CORP
Part Package Code	TSOP	SSOP
Package Description	SOT-753, 5 PIN	TSSOP,
Pin Count	5	5
Manufacturer Package Code	SOT753
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Samacsys Manufacturer	Nexperia	Toshiba
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3
Length	2.9 mm	2 mm
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR, 7 INCH
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	14 ns	15.6 ns
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.95 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1.5 mm	1.25 mm
Base Number Matches	1	7
Qualification Status		Not Qualified
	Logic » Gates	Logic » Gates