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74LVC1G57GW,125 vs 74LVC1G57GW feature comparison

74LVC1G57GW,125 Nexperia

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74LVC1G57GW Philips Semiconductors

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA PHILIPS SEMICONDUCTORS
Part Package Code TSSOP
Package Description PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count 6
Manufacturer Package Code SOT363-2
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e0
Length 2 mm
Logic IC Type LOGIC CIRCUIT
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP6,.08
Prop. Delay@Nom-Sup 7.9 ns
Schmitt Trigger YES
Logic » Other Logic ICs
Logic » Gates

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