74LVC1G58GW
vs
NL7SZ57DFT2G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
| Part Package Code |
SOT-363
|
SC-88/SC70-6/SOT-363 6 LEAD
|
| Package Description |
PLASTIC, SOT-363, SC-88, 6 PIN
|
SOT-363, 6 PIN
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G6
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
LOGIC CIRCUIT
|
MAJORITY LOGIC GATE
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Terminals |
6
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP6,.08
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Prop. Delay@Nom-Sup |
7.9 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Tin (Sn)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
1.25 mm
|
|
| Base Number Matches |
4
|
2
|
| Manufacturer Package Code |
|
419B-02
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
|
|
|
Compare 74LVC1G58GW with alternatives
Compare NL7SZ57DFT2G with alternatives