74LVC1G98GW
vs
74LVC1G58GW,125
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Part Package Code |
SOT-363
|
TSSOP
|
| Package Description |
Plastic, Sot-363, Sc-88, Package-6
|
Plastic, Sot-363, Sc-88, 6 Pin
|
| Pin Count |
6
|
6
|
| HTS Code |
8542.39.00.60
|
8542.39.00.01
|
| Family |
Lvc/Lcx/Z
|
Lvc/Lcx/Z
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 Mm
|
2 Mm
|
| Logic IC Type |
Majority Logic Gate
|
Logic Circuit
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
TSSOP6,.08
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Small Outline, Thin Profile, Shrink Pitch
|
| Peak Reflow Temperature (Cel) |
Not Specified
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 Mm
|
1.1 Mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Automotive
|
Automotive
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.65 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
Not Specified
|
30
|
| Width |
1.25 Mm
|
1.25 Mm
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
SOT363
|
| Load Capacitance (CL) |
|
50 Pf
|
| Max I(ol) |
|
0.024 A
|
| Packing Method |
|
Tr
|
| Prop. Delay@Nom-Sup |
|
7.9 Ns
|
| Schmitt Trigger |
|
Yes
|
|
|
|