Findchips: Compare 74LVC2G04GV,165 vs 74LVC2G06GS

74LVC2G04GV,165 vs 74LVC2G06GS feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	TSOP	SON
Package Description	TSSOP, TSOP6,.11,37	1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6
Pin Count	6	6
Manufacturer Package Code	SOT457
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	S-PDSO-N6
JESD-609 Code	e3	e3
Length	2.9 mm	1 mm
Load Capacitance (CL)	50 pF
Logic IC Type	INVERTER	INVERTER
Max I(ol)	0.024 A
Moisture Sensitivity Level	1	1
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	VSON
Package Equivalence Code	TSOP6,.11,37
Package Shape	RECTANGULAR	SQUARE
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED
Propagation Delay (tpd)	9.5 ns	8.2 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.1 mm	0.35 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)	Tin (Sn)
Terminal Form	GULL WING	NO LEAD
Terminal Pitch	0.95 mm	0.35 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Width	1.5 mm	1 mm
Base Number Matches	2	2
Output Characteristics		OPEN-DRAIN
	Logic » Gates	Logic » Gates