74LVC2G07GV-Q100,125 vs 74LVC2G07GV-Q100H feature comparison

74LVC2G07GV-Q100,125 NXP Semiconductors

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74LVC2G07GV-Q100H NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSOP, TSSOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2.9 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 8.4 ns 8.4 ns
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1.5 mm 1.5 mm
Base Number Matches 1 2
Part Package Code TSOP
Pin Count 6
Manufacturer Package Code SOT457

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