Findchips: Compare 74LVC2G07GV-Q100,125 vs 74LVC2G17GW

74LVC2G07GV-Q100,125 vs 74LVC2G17GW feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Active
Ihs Manufacturer	NXP SEMICONDUCTORS	NEXPERIA
Package Description	TSOP,	TSSOP-6
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
Length	2.9 mm	2 mm
Logic IC Type	BUFFER	BUFFER
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	8.4 ns	13.1 ns
Screening Level	AEC-Q100
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.95 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	1.5 mm	1.25 mm
Base Number Matches	1	3
Rohs Code		Yes
ECCN Code		EAR99
Date Of Intro		2017-02-18
JESD-609 Code		e3
Load Capacitance (CL)		50 pF
Max I(ol)		0.032 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP6,.08
Peak Reflow Temperature (Cel)		260
Power Supply Current-Max (ICC)		0.004 mA
Schmitt Trigger		YES
Terminal Finish		TIN
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates