Findchips: Compare 74LVC2G07GV-Q100,125 vs SN74LVC2G07DBVRE4

74LVC2G07GV-Q100,125 vs SN74LVC2G07DBVRE4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	TEXAS INSTRUMENTS INC
Package Description	TSOP,	LSSOP, TSOP6,.11,37
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
Length	2.9 mm	2.9 mm
Logic IC Type	BUFFER	BUFFER
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSOP	LSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Propagation Delay (tpd)	8.4 ns	8.6 ns
Screening Level	AEC-Q100
Seated Height-Max	1.1 mm	1.45 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.95 mm	0.95 mm
Terminal Position	DUAL	DUAL
Width	1.5 mm	1.6 mm
Base Number Matches	1	1
Rohs Code		Yes
Part Package Code		SOT-23
Pin Count		6
Samacsys Manufacturer		Texas Instruments
JESD-609 Code		e4
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSOP6,.11,37
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		3.7 ns
Qualification Status		Not Qualified
Schmitt Trigger		NO
Terminal Finish		NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates