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74LVC2G14GW,125 vs SN74LVC2G14DCK3 feature comparison

74LVC2G14GW,125 NXP Semiconductors

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SN74LVC2G14DCK3 Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP
Package Description PLASTIC, SOT-363, SC-88, 6 PIN SC-70, 6 PIN
Pin Count 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP Texas Instruments
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e6
Length 2 mm 2 mm
Logic IC Type INVERTER INVERTER
Max I(ol) 0.024 A 0.032 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 12 ns 10.5 ns
Qualification Status Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin/Bismuth (Sn/Bi)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Power Supply Current-Max (ICC) 0.01 mA
Logic » Gates
Logic » Gates

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