74LVCH16244ABQ
vs
74ALVCH162244DGG,1
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
HVBCC,
|
PLASTIC, TSSOP2-48
|
| Pin Count |
60
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PBCC-B60
|
|
| JESD-609 Code |
e4
|
|
| Length |
6 mm
|
|
| Logic IC Type |
BUS DRIVER
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Bits |
4
|
|
| Number of Functions |
4
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
60
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVBCC
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
6 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.5 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
BUTT
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4 mm
|
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
SOT362-1
|
|
|
|
Compare 74LVCH16244ABQ with alternatives