74LVCH16244ABQ vs 74ALVCH16244DGG:11 feature comparison

74LVCH16244ABQ NXP Semiconductors

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74ALVCH16244DGG:11 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN TSSOP
Package Description HVBCC, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48
Pin Count 60 48
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Family LVC/LCX/Z ALVC/VCX/A
JESD-30 Code R-PBCC-B60 R-PDSO-G48
JESD-609 Code e4 e4
Length 6 mm 12.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 2
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 60 48
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVBCC TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 6 ns 5.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form BUTT GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4 mm 6.1 mm
Base Number Matches 1 2
Manufacturer Package Code SOT362-1
Control Type ENABLE LOW
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP48,.3,20
Prop. Delay@Nom-Sup 3 ns

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