79RC32V334150BBI vs 79RC32V334150BBGI feature comparison

79RC32V334150BBI Integrated Device Technology Inc

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79RC32V334150BBGI Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA256,16X16,40 BGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75.02 MHz 75.02 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Speed 150 MHz 150 MHz
Supply Current-Max 700 mA 700 mA
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare 79RC32V334150BBI with alternatives

Compare 79RC32V334150BBGI with alternatives