8101801EX
vs
5962R9665103VEC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-XDIP-T16
|
R-CDIP-T16
|
| Number of Channels |
2
|
2
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
16
|
16
|
| On-state Resistance-Max (Ron) |
1300 Ω
|
320 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Signal Current-Max |
0.01 A
|
|
| Surface Mount |
NO
|
NO
|
| Switch-on Time-Max |
936 ns
|
972 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
2
|
| JESD-609 Code |
|
e4
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Supply Current-Max (Isup) |
|
0.025 mA
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Switch-off Time-Max |
|
608 ns
|
| Terminal Finish |
|
GOLD
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|