Findchips: Compare 8403701CX vs 74HCT00D,653

8403701CX vs 74HCT00D,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	TEXAS INSTRUMENTS INC	NXP SEMICONDUCTORS
Part Package Code	DIP	SOIC
Package Description	DIP,	SO-14
Pin Count	14	14
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HCT
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
Length	19.56 mm	8.65 mm
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Propagation Delay (tpd)	135 ns	29 ns
Qualification Status	Qualified	Not Qualified
Screening Level	MIL-PRF-38535
Seated Height-Max	5.08 mm	1.75 mm
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	3.9 mm
Base Number Matches	1	1
Rohs Code		Yes
Manufacturer Package Code		SOT108-1
JESD-609 Code		e4
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		SOP14,.25
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		29 ns
Schmitt Trigger		NO
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates