8403701CX
vs
M74HC00F1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
SGS-ATES COMPONENTI ELECTRONICI S P A
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
Length
19.56 mm
Logic IC Type
NAND GATE
NAND GATE
Moisture Sensitivity Level
NOT APPLICABLE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
135 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
Base Number Matches
5
2
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Qualification Status
Not Qualified
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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