8403701CX vs MC74HCT00AD feature comparison

8403701CX Motorola Mobility LLC

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MC74HCT00AD Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Part Package Code DIP
Package Description DIP, SOP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm 8.65 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 135 ns 28 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 3.9 mm
Base Number Matches 5 3
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Terminal Finish TIN LEAD

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Compare MC74HCT00AD with alternatives