87C52/BQA
vs
SST89V54RD2-33-I-PIE
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
SILICON STORAGE TECHNOLOGY INC
|
Package Description |
DIP, DIP40,.6
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
|
JESD-30 Code |
R-XDIP-T40
|
R-PDIP-T40
|
JESD-609 Code |
e0
|
e3
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
|
ROM (words) |
8192
|
|
ROM Programmability |
UVPROM
|
FLASH
|
Screening Level |
38535Q/M;38534H;883B
|
|
Speed |
12 MHz
|
33 MHz
|
Supply Current-Max |
35 mA
|
|
Supply Voltage-Nom |
5 V
|
3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
40
|
Has ADC |
|
NO
|
Address Bus Width |
|
16
|
Clock Frequency-Max |
|
33 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
NO
|
External Data Bus Width |
|
8
|
Length |
|
51.943 mm
|
Number of I/O Lines |
|
32
|
PWM Channels |
|
YES
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
5.588 mm
|
Supply Voltage-Max |
|
3.6 V
|
Supply Voltage-Min |
|
2.7 V
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|
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