89HPES24T6G2ZBALG8
vs
89HPES24T6G2ZAAL
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
FCBGA
|
BGA
|
| Package Description |
FCBGA-324
|
BGA,
|
| Pin Count |
324
|
324
|
| Manufacturer Package Code |
ALG324
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Bus Compatibility |
PCI; SMBUS
|
|
| Clock Frequency-Max |
100 MHz
|
125 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| JESD-609 Code |
e1
|
e0
|
| Length |
19 mm
|
19 mm
|
| Moisture Sensitivity Level |
4
|
|
| Number of Terminals |
324
|
324
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA324,18X18,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.42 mm
|
3.42 mm
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
19 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| Drive Interface Standard |
|
IEEE 1149.1
|
|
|
|
Compare 89HPES24T6G2ZBALG8 with alternatives
Compare 89HPES24T6G2ZAAL with alternatives